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Virtium Technology, Inc.

Options for Improved Thermal Management

13) Choose memory modules with a mezzanine connector scheme that does not block air flow

      Memory modules can be made in such a way to allow airflow across the short side of the

      DIMM to eliminate heat from being dragged across the long side of the DIMM. This

      technique does not expose as many DRAMs to the preheated air from the DRAMs upstream

      in the airflow.