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Virtium Technology, Inc.

Definitions-Acronyms-Glossary


1) Click on a the first letter of the word you want to find


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or 2) enter the word you want to find



or 3) scroll down for word you want to find

 

additive latency

 

AMB

 

Bank

 

Beveled Edge

 

BGA

 

BGA Fragility

 

Binning

 

Board stack

 

Burst chop

 

CAS Latency

 

Chamfered Corners

 

Channel

 

Chipkill

 

Clamshell

 

COB

 

DAC

 

Date codes

 

DDDC

 

 

DDP (or die stack)

 

DDR

 

Density

 

Die Shrink

 

Die Stack (or stacked die)

 

DIMM (Memory Module)

 

DIMM key

 

DIMM spacing

 

Downgraded chips

 

Dynamic ODT

 

ECC

 

ECC DIMM

 

eDRAM

 

Ejectors

 

EMD

 

ETT chips

 

FBDIMM

 

Fly-by

 

Gold Fingers

 

Guardband

 

Heat spreader

 

IBIS

 

JEDEC

 

JEDEC Enhanced

 

Keep-away zone

 

Latency

 

Lot codes
 

 

MCH

 

Monolithic chip

 

MPR

 

OCD

 

Off-spec chips

 

Package stack

 

Parity

 

Planer Memory Module

 

Probe Map

 

QDP

 

Quad rank

 

RAMpedia

 

raw card (R/C)

 

Rank

 

RDIMM

 

Register (or buffer)

 

RoHS

 

Row

 

Row Address

 

SAC solder

 

SBE

 

Screening

 

SDDC

 

SDR

 

Side Notches

 

Silkscreen resistors

 

Singulation

 

Slot

 

SO-CDIMM

 

SO-RDIMM

 

SPD

 

Stacked chip (or chip stack)

 

Stacked Memory Module

 

Test VIAs

 

Tie bars

 

UDIMM

 

UTT chips

 

VHD

 

VLP

 

ULP

 

WLCSP

 

ZQ Calibration

 

(keyword search: what is, define )

 
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