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Virtium Technology, Inc.

Archived News

 

June 2007

 
PUBLICATION OF JEDEC DDR3 SDRAM STANDARD
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New Freescale Flexis Microcontrollers for 8- and 32-bit architectures
 
PICMG forms Rugged MicroTCA subcommittee
 
Freescale and Tundra Semiconductor Introduce AMC single-width form factor Development Platform Enabled by RapidIO®
 
Intel now offering memory scrubbing technology called Double Device Data Correction (DDDC).
 
IBM patents external DRAM box.
 
The SCOPE Alliance Releases Its AMC Port Map Gap-Analysis v1.0
 
SoC SDRAM memory subsystem reference design from Sonics and Synopsys

May 2007

 
So, What Was That Memory Technology Again?
 
AMD Releases Expanded Tools and Support for Developers using Multi-Core AMD64 Systems
 
32bit OS going EOL: Vista will be the last version of Windows for Pentium 4 and Core Duo owners
 
Intel releases Turbo Memory (previously codenamed Robson)
 
AMD Chooses High-Speed DDR2-1066 over DDR3 for this year with new Quad-Core Desktop Chips

Micron prepares DDR2-1066 (PC2-8500) DRAM using 78nm process

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Hynix is 1st to receive Intel validation on DDR3 DRAM

April 2007

 

 
The high power consumption of DRAM memory in servers
 
SanDisk & Qimonda create joint venture to make flash-DRAM multichip packaging (MCP) for mobile storage
 
Microchip Technology receives top position for 8-bit microcontrollers
 
Ferroelectric FRAM memory chips now reach 2Mbit capacity
 
IDT Unveils Its Low-Power AMB for FBDIMMs
 
Samsung develops 4GB DDR2 DIMM via new stacking technology
 
Intel moves closer to flash and DRAM memory replacement phase-change technology
 
Micron intoduces low-power 1.5v DDR2 DRAMs
 
Zero-Capacitor DRAM memory technology for Systems-on-Chip (SoC)
 
SST Redefines Memory Subsystem in Embedded and Mobile Applications with All-in-OneMemory Solutions
 
Vertical Stacking to Redefine Chip Design
 
Intel and AMD spotlight embedded offerings
 
PICMG adds Ethernet fabric to Advanced Mezzanine Card (AMC)
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March 2007

Hynix Develops High Speed Mobile DRAM with ECC
 
Elpida joins IMEC to develop nanoelectronics beyond 50nm DRAM process generations.
 
EDNs outlook on memory
 
DRAM sales up in year-on-year growth in Jan07 at lower DRAM prices
 
Worldwide server shipments experience 9% growth in 2006
 
Industry panel discusses "keep-it-cool strategies " and thermal issues for chips, boards, systems.
 
AMD prepares for DDR3 support
 
AMD Barcelona quad-core Opteron processor vs Intel, Clovertown quad-core Xeon
 
Samsung goes into mass production of DDR2 1Gb DRAM using 60nm process


February 2007

IBM adds 48MB of DRAM to next-gen microprocessor using 45nm process available in 2008
 
STT-RAM - possible replacement for SRAM, DRAM and FLASH
 
Intel P35 Express desktop chipset (Bearlake) is first to support DDR3 DRAM on motherboards
 
IBM Sets Memory Chip Speed Record
 
Memory Makers lower DRAM prices
 
DRAM almost as fast as SRAM
 
Intel Chip 1 trillion calculations 80cores
 
Intel "Montevina" for 2008 features new chipsets, codenamed Cantiga for Robson SSDs
 
Samsung release Industry’s First Gigabit-density Mobile DRAM
 
AMD Moving In On Embedded Processor Market
 
DRAM still dominates as main memory for computers
 
Revenue Ranking of DRAM Component Vendors
 
Intel Tolapai SOC by the end of 2007 for embedded markets
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January 2007

Hynix introduces DDR2 1Gbit DRAM die shrinks using 60nm process
 
Micron now shipping DDR2 512Mbit DRAM with copper interconnects
 
TI sampling a DDR3 Register/PLL chip which requires no PLL tuning for RDIMMs
 
Computers using DDR3 memory prepare to ship in 2007
 
Micron offers samples of DDR3 1Gbit DRAM at DDR3-800 and DDR3-1066
 
A new Hybrid Storage Alliance has been created to combine the benefits of Flash NAND caching with high capacity low cost HDDs for Intel Robson and Microsoft Vista technology.
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